Support a variety of customization / professional technical support / please contact customer service if you have any questions.
Dimensions: 15 mm x 11.3 mm x 1.4 mm
Dimensions: 24 mm x 11 mm x 1.4 mm
One-piece WAFER packaging technology
Thin, light, stylish
Easy and simple assembly
Product standardization, suitable for customers to do a variety of mold design on this basis
UDP module + shell = U disk
Due to the small size of the UDP module, it is convenient to design various types of housings, and the assembly is simple, and basically no welding is required, which can greatly improve the production capacity and reduce the production cost of the U disk.
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Waterproof, dustproof and shockproof.
UDP (USB Disk in Package) uses a new processing technology called PIP encapsulation. PIP is a shorthand for the English Product In Package. The technology integrates the PCB substrate assembly and semiconductor packaging process, and directly encapsulates the components required for the small memory card (controller flash IC substrate passive components) to form a finished flash memory card. For consumers, the direct consequences of PIP`s technical advantages are obvious: high read/write speed, ruggedness (up to 50 Newtons), strong waterproof, anti-static, high temperature resistance, etc. It is the best choice for digital storage. According to industry insiders, the emergence of integrated packaging technology has made the packaging technology of digital storage products a breakthrough, and it is likely to become the mainstream packaging technology for small memory cards.
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For consumers, the direct consequences of PIP`s technological advantages are obvious: the memory card`s large capacity, high read/write speed, ruggedness (resistance to heavy pressure of 50 Newtons), strong waterproof, anti-static, high temperature resistance, etc. The combination of advantages is definitely the best choice for digital memory cards. According to industry insiders, the emergence of integrated packaging technology has made the packaging technology of digital storage products a breakthrough, and it is likely to become the mainstream packaging technology for small memory cards.
1, quality assurance, no fakes
Most of the memory cards on the market are basically packaged flash memory chips purchased by the manufacturer. After soldering on the substrate, two plastic plates are used for ultrasonic sealing. Finally, the label paper is used for labeling. This kind of practice is very easy for the counterfeiters to do their hands and feet. For example, the label paper can be replaced, the plastic chip can be opened to replace the internal flash memory chip, or the counterfeit goods can be directly attached to the brand label, etc., so that the interests of the consumer are damaged.
Xinkete PIP package memory card starts from the purchase of the most original wafer, and then uses PIP packaging technology to package all parts at one time. There is no gap on the card. To copy the unique PIP packaging technology of Kingmax, the minimum investment is required. At the threshold of more than 100 million yuan to enter the BGA package, some counterfeiters can only retreat, which is the main reason why Kingmax memory cards do not have fakes.
2, long service life, energy saving
Kingmax products using PIP packaging technology follow the exclusive patented TinyBGA technology in the memory field, completely encapsulating the working components inside, the working components are not eroded by external dust and debris, and are not affected by sunlight. The product loss is reduced from the packaging technology, and the service life of the product is improved.
In addition, due to the adoption of DSLC technology, the memory card write life is up to 100,000 times, far exceeding the life of the general memory card currently on the market, and the DSLC technology is more energy efficient than the general MLC technology.
3, waterproof, heat and pressure resistance, challenge the limit
For consumers, PIP package memory cards are also unique in terms of water resistance, high temperature resistance and pressure resistance. Since the memory card is completely enclosed and falls into the water, the data will not be lost because the water does not damage the working components. The encapsulation layer is made of a unique material and is fully considered for insulation and pressure resistance. According to the test results, the U disk with PIP packaging technology will not lose data in 100 degrees of water, and can resist the weight of a truck.
4, colorful, visual enjoyment
Utilizing the advantages and features of PIP packaging technology, U disk can be made into any desired style, so Xinkete U disk also has a very unique style, and created a beautiful color U disk, the first in the industry